Publication

International Journal and Conference

Domestic Journal

Domestic Conference

In Preparation

[JP]  H. Lee, et. al., “Multi-Resource Unit-based Sensing System with a Neural Network,” in preparation.

[JP] K. Park, and H. Lee*, "Real-time TSV 3D Shape Defect Inspection System using YOLOv10," in preparation for Journal of Semiconductor Technology and Science (JSTS).

Submitted or Under Revision

[JS] Jae-Hyeon Park, Young-Joo Suh, Harim Lee, Hyeongtae Ahn, and Young Deok Park*, MILD: Minimizing Idle Listening Energy Consumption via Down-clocking for Energy Efficient Wi-Fi Communications under minor revision, Sensors.

[JS] J. Y. Lee, J. Y. Suh, S. J. Park, H. Lee*, "Hardware Implementation of Convolution layer for Quantized Deep Neural Networks in Image Classification," under minor revision, The Transactions of the Korean Institute of Electrical Engineers (KIEE) [Scopus].